The company turns to Russian CPUs to continue building automatic teller machines.

As the war in Ukraine intensifies, Russia continues to face sanctions over its conduct in fueling the conflict. In terms of technology, many brands have already turned away from the Eurasian country, namely Intel, AMD and Nvidia.

As a result, Vladimir Putin’s country is trying to find alternatives to the sanctions. And according to recent news, BFS is now turning to Russian Elbers processing chips, manufactured in the region, to continue the manufacture of automatic teller machines.

Russian Albers processors developed automatic teller machines.

Life is not easy for Russia, as the various sanctions imposed on the country are aimed at affecting various sectors, such as the financial market and the technology industry. In view of this, the government of the country has announced some measures, such as the intention to manufacture 28nm chips locally by 2030.

In addition, it was recently announced that the Russian company BFS will use processors manufactured in the region to continue manufacturing its automated teller machines. This is due to cuts in access to devices from various manufacturers, such as AMD, Intel and ARM, and as a result, the company is no longer able to use their components to power its automated boxes.

The solution, at least for now, is the use of Elbrus CPUs, developed by the Russian company MCST (Moscow Center of Spark Technologies), one of Putin's leading chip manufacturers in the country. ۔ In addition, BFS will use self-developed software.

According to the details disclosed, the ATM company then intends to mass-produce its automatic teller machines, and it is estimated that between February and March 2023, between about 1500 units will begin to arrive. The BFS adds that "Technical level [das caixas] Will meet the needs of the market and will not lose foreign products."

Boxes will be the first to use the Russian Albers processor, which should have 8 cores at a frequency of 1.30 GHz. It will also have Level 2 (L2) 4 MB and L3 Level 16 MB. The chip will have 28nm manufacturing process and 250 GLOPS performance. In terms of competition, the processor will be slower than the 4-core AMD Phenom II X4 965 that was released in August 2009.

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